Patent 08097956 - Flexible packaging for chip-on-chip and package-on-package technologies > Summary

Patent No. US 08097956

Published on Jan 17, 2012

Application No. 12/402633

Filed on Mar 12, 2009

Priority Date -

von Kaenel, Vincent R. - Palo Alto, CA US (3)

In one embodiment, a packaging solution for an application integrated circuit (IC) and one or more other ICs is provided. The packaging solution may support both chip-on-chip packaging of the application IC (in flip-chip connection to a package substrate) and other ICs (in non-flip chip orientation), and package-on-package packaging of the application IC and the other ICs. The package substrate may include a first set of pads proximate to the application IC to support chip-on-chip connection to the other ICs. The pads may be connected to conductors that extend underneath the application IC, to connect to the application IC. A second set of pads may be connected to package pins for package-on-package solutions. If the chip-on-chip solution proves reliable, support for the package-on-package solution may be eliminated and the package substrate may be reduced in size.

Nguyen, Ha Tran T