Patent Application - APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT > Claims

1. An apparatus for mounting an electronic component, the apparatus comprising: a heating head that moves relative to the electronic component placed on a printed board, inclines according to an inclination of the electronic component, comes into contact with the electronic component, and heats a joining material that joins the printed board and the electronic component;a first sensor that measures the position and an inclination of the heating head;a second sensor that measures a position and an inclination of the printed board; anda control unit that calculates the position and the inclination of the electronic component based on a measurement result of the first sensor in a state where the heating head is in contact with the electronic component, and determines a melted state of the joining material based on the measurement result of the second sensor and the position and the inclination of the electronic component.
- 2. The apparatus according to claim 1, wherein the second sensor is positioned to measure three points including the printed board and another electronic component; and the control unit calculates the position and the inclination of the printed board based on a measurement result of the second sensor and a height of the other electronic component from the printed board.
- 3. The apparatus according to claim 1, wherein the control unit retracts the heating head from the electronic component according to the determination result of the state of melting of the joining material.
- 4. The apparatus according to claim 1, wherein the control unit sets a position of a stopper at a target stopping position and an inclination at the target stopping position for the heating head on the basis of the measurement result of the second sensor.
  - 5. The apparatus according to claim 4, wherein the control unit calculates the target stopping position and the inclination at the target stopping position based on a measurement result of the second sensor after the start of heating by the heating head and before the melting of the joining material.
  - 6. The apparatus according to claim 4, wherein the stopper includes three stoppers each having an independently regulated position.
7. A method for mounting an electronic component, the method comprising the steps of: heating a joining material that joins a printed board and the electronic component using a heating head that moves relative to the electronic component placed on the printed board, inclines according to an inclination of the electronic component, and comes into contact with the electronic component;measuring a position and an inclination of the heating head;measuring a position and an inclination of the printed board;calculating a position and the inclination of the electronic component based on a measurement result of a first sensor in a state where the heating head is in contact with the electronic component; anddetermining a melted state of the joining material based on a measurement result of a second sensor and the position and the inclination of the electronic component.