Patent Application - Method of manufacturing a printed circuit board having metal bumps > Summary

Patent Application No. US 20120060365

Published on Mar 15, 2012

Application No. 13/373387

Filed on Nov 14, 2011

Priority Date -

Kang, Myung Sam - Gyunggi-do, KR (55)

A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a first carrier, forming a first barrier layer on the first carrier, and forming an upper circuit layer on the first barrier layer, the upper circuit layer including a metal bump charged in the recess and a circuit pattern; forming a second barrier layer on a second carrier, and forming a lower circuit layer on the second barrier layer; preparing an insulating layer, and transferring the upper and lower circuit layers to the insulating layer; removing the first and second carriers; and removing the first and second barrier layers.