Patent 11203816 - Electroplating seed layer buildup and repair > Summary

US Patent

Patent Application No. US 11203816

Published on Dec 21, 2021

Application No. 17/079127

Field on Oct 23, 2020

Classification

International:

C25D 5/18

C25D 7/12;

H01L 21/768;

H01L 21/288;