Patent Application 20210400820 - PREPARATION OF SOLDER BUMP FOR COMPATIBILITY WITH PRINTED ELECTRONICS AND ENHANCED VIA RELIABILITY > Summary

US Patent Application

Patent Application No. US 20210400820

Published on Dec 23, 2021

Application No. 17/465292

Field on Sep 2, 2021

Classification

International:

H05K 3/34

H05K 3/00;