Patent Application 20210400820 - PREPARATION OF SOLDER BUMP FOR COMPATIBILITY WITH PRINTED ELECTRONICS AND ENHANCED VIA RELIABILITY > Summary
US Patent Application
Patent Application No. US 20210400820
Published on Dec 23, 2021
Application No. 17/465292
Field on Sep 2, 2021
Classification
International:
H05K 3/34
H05K 3/00;