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Patent 06387824 - Method for forming porous forming film wiring structure > Summary

US Patent

Patent No. US 06387824

Published on May 14, 2002

Application No. 09/492349

Filed on Jan 27, 2000

Priority Date -

Inventor/Applicants

Aoi, Nobuo - Hyogo, JP

Classification

International:

H01L 21/00

National:3

438/778

438/625;

427/245;

Field of Search 10

438/778

438/700;

438/706;

438/623;

438/624;

438/625;

438/487;

438/790;

438/627;

438/637;

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