Search
Patexia Research

Patent 07221173 - Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process > Summary

US Patent

Patent No. US 07221173

Published on May 22, 2007

Application No. 10/953291

Filed on Sep 29, 2004

Priority Date -

Inventor/Applicants

4

Bachman, Mark Adam - Sinking Spring, PA US

Chesire, Daniel Patrick - Winter Garden, FL US

Kook, Taeho - Orlando, FL US

Merchant, Sailesh M. - Macungie, PA US

Classification

International:

G01R 31/02

National:

324/754

Field of Search 14

324/754

324/763;

324/765;

324/158.1;

324/72.5;

324/73.1;

324/760;

438/18;

438/132;

438/FOR.0101;

438/FOR.0142;

438/8;

257/48;

257/529;

Examiner

2

Nguyen, Ha Tran

Nguyen, Tung X.

Menu