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Patent No. US 11075140
Issue Date Jul 27, 2021
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Patent 11075140 - Heat conduction structure or semiconductor apparatus > Summary

US Patent

Patent No. US 11075140

Published on Jul 27, 2021

Application No. 16/449999

Filed on Jun 24, 2019

Priority Date -

Inventor/Applicants

4

Bessho, Takeshi - Toyota, JP

Deguchi, Masataka - Nagoya, JP

Saito, Nagahiro - Nagoya, JP

Hashimi, Kazuo - Nagoya, JP

Classification

International:2

H01L 23/34

H01L 23/42;

Field of Search 2

257/712

257/713;

Examiner

Parekh, Nitin

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