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Patent No. US 11145579
Issue Date Oct 12, 2021
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Patent 11145579 - Thermally enhanced electronic packages for GaN power integrated circuits > Summary

US Patent

Patent No. US 11145579

Published on Oct 12, 2021

Application No. 17/169304

Filed on Feb 5, 2021

Priority Date -

Inventor/Applicants

3

Kinzer, Daniel M. - El Segundo, CA US

Zhang, Jason - Monterey Park, CA US

Ribarich, Thomas - Laguna Beach, CA US

Classification

International:4

H01L 31/0256

H01L 23/495;

H01L 23/00;

H01L 25/16;

Field of Search

257/76

Examiner

Thai, Luan C

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