Patent 11164849 - Chip assembly and chip > Summary

Patent No. US 11164849

Published on Nov 2, 2021

Application No. 17/196926

Filed on Mar 9, 2021

Priority Date -

Tian, Kai - Hefei, CN

Li, Hongwen - Hefei, CN

International:3

H01L 23/528

H01L 25/065;

H01L 23/00;

Harriston, William A