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Patent No. US 11164849
Issue Date Nov 2, 2021
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Patent 11164849 - Chip assembly and chip > Summary

US Patent

Patent No. US 11164849

Published on Nov 2, 2021

Application No. 17/196926

Filed on Mar 9, 2021

Priority Date -

Inventor/Applicants

2

Tian, Kai - Hefei, CN

Li, Hongwen - Hefei, CN

Classification

International:3

H01L 23/528

H01L 25/065;

H01L 23/00;

Examiner

Harriston, William A

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