Patent 11203816 - Electroplating seed layer buildup and repair > Summary

Patent No. US 11203816

Published on Dec 21, 2021

Application No. 17/079127

Filed on Oct 23, 2020

Priority Date -

Bernt, Marvin L. - Whitefish, MT US

Burnham, James C. - Kalispell, MT US

Mikkola, Robert - Kalispell, MT US

International:4

C25D 5/18

C25D 7/12;

H01L 21/768;

H01L 21/288;

Cohen, Brian W