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Patent No. US 11357097
Issue Date Jun 7, 2022
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Patent 11357097 - High performance thermal solution concept for surface mount device packages > Summary

US Patent

Patent No. US 11357097

Published on Jun 7, 2022

Application No. 17/077933

Filed on Oct 22, 2020

Priority Date -

Inventor/Applicants

3

Lin, Yung You - New Taipei, TW

Chiang, Lien Jin - New Taipei, TW

Chang, Hung Cheng - New Taipei, TW

Classification

International:2

H05K 1/02

H05K 1/18;

Field of Search

361/704

Examiner

Ng, Sherman

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