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Patexia Research
Issue Date Dec 23, 2021
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Patent Application - PREPARATION OF SOLDER BUMP FOR COMPATIBILITY WITH PRINTED ELECTRONICS AND ENHANCED VIA RELIABILITY > Summary

US Patent Application

Patent Application No. US 20210400820

Published on Dec 23, 2021

Application No. 17/465292

Filed on Sep 2, 2021

Priority Date -

Inventor/Applicants

5

Benedict, James E. - Lowell, MA US

Beninati, Gregory G. - Salem, NH US

Pevzner, Mikhail - Woburn, MA US

Sikina, Thomas V. - Acton, MA US

Southworth, Andrew R. - Lowell, MA US

Classification

International:2

H05K 3/34

H05K 3/00;

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