Microelectronic packages with enhanced heat dissipation and methods of manufacturing | Patent Application Number 12970729

12970729
Not Appealed
Patent NumberUS 08283758 B2
Publication NumberUS 20120153446 A1
Filled DateDec 16, 2010
Priority DateDec 16, 2010
Inventor/ApplicantsHunt Hang Jiang
ExaminesKARIMY, TIMOR
Art Unit2894
Technology Center2800
Assignments
Monolithic Power Systems
Current
Monolithic Power Systems
Original
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