Microelectronic packages with enhanced heat dissipation and methods of manufacturing | Patent Number 08283758

US 08283758 B2
Application Number12970729
Publication NumberUS 20120153446 A1
Pendency1 year, 9 months, 28 days
Filled DateDec 16, 2010
Priority DateDec 16, 2010
Publication DateJun 21, 2012
Expiration DateDec 15, 2030
Inventor/ApplicantsHunt Hang Jiang
ExaminesKARIMY, TIMOR
Art Unit2894
Technology Center2800
Assignments
Monolithic Power Systems
Current
Monolithic Power Systems
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