Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing | Patent Application Number 12970784
12970784
Not Appealed
Patent NumberUS 08361899 B2
Publication NumberUS 20120153447 A1
Filled DateDec 16, 2010
Priority DateDec 16, 2010
Inventor/ApplicantsHunt Hang Jiang
ExaminesKARIMY, TIMOR
Art Unit2894
Technology Center2800
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