Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing | Patent Number 08361899

US 08361899 B2
Application Number12970784
Publication NumberUS 20120153447 A1
Pendency2 years, 1 month, 15 days
Filled DateDec 16, 2010
Priority DateDec 16, 2010
Publication DateJun 21, 2012
Expiration DateDec 15, 2030
Inventor/ApplicantsHunt Hang Jiang
ExaminesKARIMY, TIMOR
Art Unit2894
Technology Center2800
Assignments
Monolithic Power Systems
Current
Monolithic Power Systems
Original
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