Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing | Patent Publication Number 20120153447
US 20120153447 A1Patent NumberUS 08361899 B2
Application Number12970784
Filled DateDec 16, 2010
Priority DateDec 16, 2010
Publication DateJun 21, 2012
Original AssigneeMonolithic Power Systems
Current AssigneeMonolithic Power Systems
Inventor/ApplicantsHunt Hang Jiang
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