Face-up semiconductor chip assembly | Patent Number 05852326

US 05852326 NA
Application Number110527
Publication Number-
Pendency5 months, 19 days
Filled DateJul 6, 1998
Priority Date-
Publication Date-
Expiration DateDec 22, 2002
Inventor/Applicants Jaimy Chuang
Igor Y. Khandros
Thomas H. Distefano
Examines-
Art Unit0
Technology Center0
Assignments
Xperi Corporation
Current
Tessera XperiXperi Corporation
Original
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