Method for forming porous forming film wiring structure | Patent Number 06387824

US 06387824 B1
Application Number9492349
Publication Number-
Pendency2 years, 3 months, 18 days
Filled DateJan 27, 2000
Priority DateJan 27, 2000
Publication Date-
Expiration DateJan 27, 2020
Inventor/ApplicantsNobuo Aoi
ExaminesLE, DUNG ANH
Art Unit2818
Technology Center2800
Assignments
Godo Kaisha Ip Bridge 1
Current
Panasonic
Original
Law Firm
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