Method for making an interconnect layer and a semiconductor device including the same | Patent Number 06436807

US 06436807 B1
Application Number9484310
Publication Number-
Pendency2 years, 7 months, 5 days
Filled DateJan 18, 2000
Priority DateJan 18, 2000
Publication Date-
Expiration DateJan 18, 2020
Inventor/ApplicantsSudhanshu Misra
Dennis Okumu Ouma
Donald Thomas Cwynar
Vivek Saxena
John Michael Sharpe
ExaminesROCCHEGIANI, RENZO
Art Unit2825
Technology Center2800
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