Thin form factor flip chip ball grid array | Patent Number 06441499

US 06441499 B1
Application Number9651308
Publication Number-
Pendency1 year, 12 months, 2 days
Filled DateAug 30, 2000
Priority DateAug 30, 2000
Publication Date-
Expiration DateAug 30, 2020
Inventor/ApplicantsSarathy Rajagopalan
Kumar Nagarajan
ExaminesHA, NATHAN W
Art Unit2814
Technology Center2800
Assignments
Hilco Patent Acquisition 55 Llc
Current
Bell Semiconductor Llc
Current
Bellnorthern Research
Current
Lsi Logic Corporation
Original
Law Firm
You must be logged in to view
Login
Attorneys
Subscription-Only
View Concierge Program
Patent Prosecution report image

Empower your practice with Patexia Publication Prosecution IP Module.

Get access to our exclusive rankings and unlock powerful data.
Check our Latest ReportPurchase IP Module

Looking for a Publication Attorney?

Get in touch with our team or create your account to start exploring a network of over 120K attorneys.