Three metal process for optimizing layout density | Patent Number 06459625

US 06459625 B1
Application Number9767341
Publication Number-
Pendency1 year, 8 months, 11 days
Filled DateJan 23, 2001
Priority DateFeb 25, 2000
Publication Date-
Expiration DateFeb 25, 2020
Inventor/ApplicantsJonathan S. Su
Colin S. Bill
Ravi P. Gutala
ExaminesLE, THONG QUOC
Art Unit2818
Technology Center2800
Assignments
Morgan Stanley Senior Funding Inc.
Current
Advanced Micro Devices Inc
Original
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