Memory module structure | Patent Number 06642554

US 06642554 B2
Application Number9996675
Publication NumberUS 20030094628 A1
Pendency1 year, 11 months, 18 days
Filled DateNov 21, 2001
Priority DateNov 21, 2001
Publication DateMay 22, 2003
Expiration DateNov 21, 2021
Inventor/ApplicantsWu Hsiang Lee
Yves Huang
C. S. Cheng
May Chen
Fu Yung Huang
Nai Hua Yeh
Ren Long Kau
Nai Hua Yeh
Yves Huang
Fu Yung Huang
Chih Hsien Chung
Chief Lin
Kuang Yu Fan
Chen Pin Peng
Chih Hsien Chung
Chief Lin
C.S. Cheng
Ren Long Kau
Wu Hsiang Lee
May Chen
Chen Pin Peng
Kuang Yu Fan
ExaminesTRAN, MAI HUONG C
Art Unit2818
Technology Center2800
Assignments
Haystack Ip Llc
Current
Kingpak Technology Inc.
Original
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