Multi chip module | Patent Number 06680532

US 06680532 B1
Application Number10265751
Publication Number-
Pendency1 year, 3 months, 15 days
Filled DateOct 7, 2002
Priority DateOct 7, 2002
Publication Date-
Expiration DateJan 20, 2016
Inventor/ApplicantsLeah M. Miller
Kishor Desai
ExaminesCRUZ, LOURDES C
Art Unit2827
Technology Center2800
Assignments
Bell Semiconductor Llc
Current
Bellnorthern Research
Current
Hilco Patent Acquisition 55 Llc
Current
Lsi Logic Corporation
Original
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