Method of manufacturing a semiconductor component | Patent Number 06806126

US 06806126 B1
Application Number10236200
Publication Number-
Pendency2 years, 1 month, 14 days
Filled DateSep 6, 2002
Priority DateSep 6, 2002
Publication Date-
Expiration DateSep 6, 2022
Inventor/ApplicantsScott Luning
Karsten Wieczorek
Thorsten Kammler
ExaminesTRAN, MAI HUONG C
Art Unit2818
Technology Center2800
Assignments
Innovative Foundry Technologies Llc
Current
Advanced Micro Devices Inc
Original
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