Multi-chip package having a contiguous heat spreader assembly | Patent Number 06963129

US 06963129 B1
Application Number10464178
Publication Number-
Pendency2 years, 4 months, 24 days
Filled DateJun 18, 2003
Priority DateJun 18, 2003
Publication Date-
Expiration DateJun 18, 2023
Inventor/ApplicantsLeah M. Miller
Kumar Nagarajan
Stan Mihelcic
Edwin M. Fulcher
Thomas Evans
ExaminesCAO, PHAT X
Art Unit2814
Technology Center2800
Assignments
Bellnorthern Research
Current
Bell Semiconductor Llc
Current
Hilco Patent Acquisition 55 Llc
Current
Lsi Logic Corporation
Original
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