Semiconductor device and method for manufacturing the same | Patent Number 07700998

US 07700998 B2
Application Number12164389
Publication NumberUS 20090014788 A1
Pendency1 year, 9 months, 24 days
Filled DateJun 30, 2008
Priority DateJun 30, 2008
Publication DateJan 15, 2009
Expiration DateApr 20, 2022
Inventor/ApplicantsHideki Okumura
Takayoshi Nogami
Hiroto Misawa
Hideki OKUMURA
ExaminesDOAN, THERESA T
Art Unit2814
Technology Center2800
Assignments
Diodes Incorporated
Current
Toshiba
Original
Law Firm
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