Semiconductor device, wiring substrate, and method for manufacturing wiring substrate | Patent Number 07728439

US 07728439 B2
Application Number10536025
Publication NumberUS 20060151870 A1
Pendency6 years, 6 months, 14 days
Filled DateNov 21, 2003
Priority DateNov 21, 2003
Publication DateJul 13, 2006
Expiration DateNov 21, 2023
Inventor/ApplicantsTomohiro Nishiyama
Masamoto Tago
ExaminesHARRISON, MONICA D
Art Unit2893
Technology Center2800
Assignments
Godo Kaisha Ip Bridge 1
Current
Nec CorporationAt&t Company
Original
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