Top layers of metal for high performance ICs | Patent Number 07999384

US 07999384 B2
Application Number11829109
Publication NumberUS 20070262456 A1
Pendency4 years, 21 days
Filled DateJul 27, 2007
Priority DateDec 21, 1998
Publication DateNov 15, 2007
Expiration DateAug 16, 2019
Inventor/ApplicantsMou-Shiung Lin
ExaminesANYA, IGWE U
Art Unit2891
Technology Center2800
Assignments
Qualcomm Technologies Inc.
Current
Megica Corporation
Original
Law Firm
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