Multiple chip module and package stacking for storage devices | Patent Publication Number 20070158808

US 20070158808 A1
Patent NumberUS 07826243 B2
Application Number11322442
Filled DateDec 29, 2005
Priority DateDec 29, 2005
Publication DateJul 12, 2007
Original AssigneeBitmicro Networks Inc.
Current AssigneeBitmicro Networks Inc.
Inventor/ApplicantsPatrick Digamon Bugayong
Rey Bruce
Ricardo Bruce
Joel Alonzo Baylon
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