Light emitting diode package with enhanced heat conduction | Patent Publication Number 20140042479

US 20140042479 A1

Patent NumberUS 09502612 B2

Application Number14047715

Filled DateOct 7, 2013

Priority DateSep 20, 2009

Publication DateFeb 13, 2014

Original AssigneeViagan Ltd.

Current AssigneeViagan Ltd.

Inventor/ApplicantsMordehai Margalit

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