Method and circuit layout for reducing post chemical mechanical polishing defect count | Patent Application Number 10054985

10054985
Not Appealed
Patent NumberUS 06552360 B1
Publication Number-
Filled DateJan 25, 2002
Priority DateJan 25, 2002
Inventor/ApplicantsYih-Shi Lin
Chun-Lien Su
Ming-Shang Chen
Tsung-Hsien Wu
Chi-Yuan Chin
ExaminesMAGEE, THOMAS J
Art Unit2811
Technology Center2800
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