Method and circuit layout for reducing post chemical mechanical polishing defect count | Patent Number 06552360

US 06552360 B1
Application Number10054985
Publication Number-
Pendency1 year, 2 months, 27 days
Filled DateJan 25, 2002
Priority DateJan 25, 2002
Publication Date-
Expiration DateJan 25, 2022
Inventor/ApplicantsYih-Shi Lin
Chun-Lien Su
Tsung-Hsien Wu
Ming-Shang Chen
Chi-Yuan Chin
ExaminesMAGEE, THOMAS J
Art Unit2811
Technology Center2800
Assignments
Macronix International
Current
Macronix International
Original
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