Package structure for a photosensitive chip | Patent Application Number 10114201
10114201
Not Appealed
Inventor/ApplicantsMeng Ru Tsai
Fu Yung Huang
Chih Cheng Hsu
Yung Sheng Chiu
Jichen Wu
Jason Chuang
Hsiu Wen Tu
Mon Nan Ho
Jachson Hsieh
Allis Chen
Fu Yung Huang
Chih Cheng Hsu
Yung Sheng Chiu
Jichen Wu
Jason Chuang
Hsiu Wen Tu
Mon Nan Ho
Jachson Hsieh
Allis Chen
ExaminesCLARK, JASMINE JHIHAN B
Art Unit2815
Technology Center2800
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