Package structure for a photosensitive chip | Patent Number 06590269

US 06590269 B1
Application Number10114201
Publication Number-
Pendency1 year, 3 months, 8 days
Filled DateApr 1, 2002
Priority DateApr 1, 2002
Publication Date-
Expiration DateApr 1, 2022
Inventor/ApplicantsJachson Hsieh
Chih Cheng Hsu
Allis Chen
Mon Nan Ho
Meng Ru Tsai
Jason Chuang
Hsiu Wen Tu
Fu Yung Huang
Jichen Wu
Yung Sheng Chiu
ExaminesCLARK, JASMINE JHIHAN B
Art Unit2815
Technology Center2800
Assignments
Kt Imaging Usa Llc
Current
Kingpak Technology Inc.
Original
Law Firm
You must be logged in to view
Login
Attorneys
Subscription-Only
View Concierge Program
Patent Prosecution report image

Empower your practice with Patexia Publication Prosecution IP Module.

Get access to our exclusive rankings and unlock powerful data.
Check our Latest ReportPurchase IP Module

Looking for a Publication Attorney?

Get in touch with our team or create your account to start exploring a network of over 120K attorneys.