Robust high density substrate design for thermal cycling reliability | Patent Application Number 10681554

10681554
Appealed
Patent NumberUS 07345245 B2
Publication NumberUS 20050077081 A1
Filled DateOct 8, 2003
Priority DateOct 8, 2003
Inventor/ApplicantsZafer Kutlu
Farshad Ghahghahi
Anand Govind
ExaminesNORRIS, JEREMY C
Art Unit2841
Technology Center2800
Assignments
Bellnorthern Research
Current
Bell Semiconductor Llc
Current
Hilco Patent Acquisition 55 Llc
Current
Lsi Logic Corporation
Original
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