Robust high density substrate design for thermal cycling reliability | Patent Number 07345245

US 07345245 B2
Application Number10681554
Publication NumberUS 20050077081 A1
Pendency4 years, 5 months, 13 days
Filled DateOct 8, 2003
Priority DateOct 8, 2003
Publication DateApr 14, 2005
Expiration DateOct 8, 2023
Inventor/ApplicantsAnand Govind
Farshad Ghahghahi
Zafer Kutlu
ExaminesNORRIS, JEREMY C
Art Unit2841
Technology Center2800
Assignments
Hilco Patent Acquisition 55 Llc
Current
Bellnorthern Research
Current
Bell Semiconductor Llc
Current
Lsi Logic Corporation
Original
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