Semiconductor structure having through-substrate via (TSV) in porous semiconductor region | Patent Application Number 16703367

16703367
Not Appealed
Patent NumberUS 11145572 B2
Publication NumberUS 20210111101 A1
Filled DateDec 4, 2019
Priority DateOct 9, 2019
Inventor/ApplicantsDavid J. Howard
ExaminesWILLIAMS, ALEXANDER O
Art Unit2826
Technology Center2800
Assignments
Newport Fab Llc
Current
Newport Fab Llc
Original
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