Low dielectric constant etch stop layers in integrated circuit interconnects | Patent Number 06388330

US 06388330 B1
Application Number9776012
Publication Number-
Pendency1 year, 3 months, 12 days
Filled DateFeb 1, 2001
Priority DateFeb 1, 2001
Publication Date-
Expiration DateFeb 1, 2021
Inventor/ApplicantsMinh Van Ngo
Dawn M. Hopper
Terri J. Kitson
Robert A. Huertas
ExaminesNGUYEN, HA TRAN
Art Unit2812
Technology Center2800
Assignments
Lone Star Silicon Innovations Llc
Current
Advanced Micro Devices Inc
Original
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