Face-up semiconductor chip assemblies | Patent Number 06433419

US 06433419 B1
Application Number9488268
Publication NumberUS 20020011663 A1
Pendency2 years, 6 months, 26 days
Filled DateJan 20, 2000
Priority DateSep 24, 1990
Publication DateJan 31, 2002
Expiration DateAug 13, 2014
Inventor/ApplicantsIgor Y. Khandros
Thomas H. Distefano
Igor Y. Khandros
Thomas H. Distefano
ExaminesGRAYBILL, DAVID E
Art Unit2827
Technology Center2800
Assignments
Xperi Corporation
Current
Tessera XperiXperi Corporation
Original
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