Face-up semiconductor chip assemblies | Patent Publication Number 20020011663

US 20020011663 A1
Patent NumberUS 06433419 B1
Application Number9488268
Filled DateJan 20, 2000
Priority DateSep 24, 1990
Publication DateJan 31, 2002
Original AssigneeXperi Corporation
Current AssigneeXperi Corporation
Inventor/ApplicantsIgor Y. Khandros
Igor Y. Khandros
Thomas H. Distefano
Thomas H. Distefano
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