Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures | Patent Number 07566964

US 07566964 B2
Application Number10675258
Publication NumberUS 20040201101 A1
Pendency5 years, 10 months, 3 days
Filled DateSep 30, 2003
Priority DateApr 10, 2003
Publication DateOct 14, 2004
Expiration DateApr 10, 2023
Inventor/ApplicantsSeung H. Kang
Kurt George Steiner
Roland P. Krebs
Sailesh Mansinh Merchant
Seung H. Kang
Kurt George Steiner
Michael C. Ayukawa
Sailesh Mansinh Merchant
Michael C. Ayukawa
Roland P. Krebs
ExaminesLOUIE, WAI SING
Art Unit2814
Technology Center2800
Assignments
Agere Systems Broadcom
Current
Agere Systems BroadcomBroadcom
Original
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