Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures | Patent Publication Number 20040201101

US 20040201101 A1

Application Number10675258

Filled DateSep 30, 2003

Priority DateApr 10, 2003

Publication DateOct 14, 2004

Original AssigneeBroadcom

Inventor/ApplicantsKurt George Steiner
Michael C. Ayukawa
Roland P. Krebs
Seung H. Kang
Roland P. Krebs
Sailesh Mansinh Merchant
Michael C. Ayukawa
Kurt George Steiner
Seung H. Kang
Sailesh Mansinh Merchant

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