Multiple chip module and package stacking method for storage devices | Patent Number 08093103

US 08093103 B2
Application Number12907023
Publication NumberUS 20110038127 A1
Pendency1 year, 2 months, 24 days
Filled DateOct 18, 2010
Priority DateDec 29, 2005
Publication DateFeb 17, 2011
Expiration DateDec 28, 2025
Inventor/ApplicantsPatrick Digamon Bugayong
Rey H. Bruce
Joel Alonzo Baylon
Ricardo Bruce
Ricardo H. Bruce
Rey BRUCE
ExaminesAHMADI, MOHSEN
Art Unit2812
Technology Center2800
Assignments
Bitmicro Networks Inc.
Current
Bitmicro Networks Inc.
Original
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