Multiple chip module and package stacking method for storage devices | Patent Publication Number 20110038127

US 20110038127 A1
Patent NumberUS 08093103 B2
Application Number12907023
Filled DateOct 18, 2010
Priority DateDec 29, 2005
Publication DateFeb 17, 2011
Original AssigneeBitmicro Networks Inc.
Current AssigneeBitmicro Networks Inc.
Inventor/ApplicantsRey BRUCE
Patrick Digamon Bugayong
Joel Alonzo Baylon
Rey H. Bruce
Ricardo Bruce
Ricardo H. Bruce
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