Substrate structure for an image sensor package and method for manufacturing the same | Patent Number 08314481

US 08314481 B2
Application Number11131727
Publication NumberUS 20060275943 A1
Pendency7 years, 6 months, 8 days
Filled DateMay 18, 2005
Priority DateMay 18, 2005
Publication DateDec 7, 2006
Expiration DateMay 17, 2025
Inventor/ApplicantsChung Hsien Hsin
Kevin Chang
Yves Huang
Chief Lin
ExaminesTRAN, THANH Y
Art Unit2829
Technology Center2800
Assignments
Kt Imaging Usa Llc
Current
Kingpak Technology Inc.
Original
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