Substrate structure for an image sensor package and method for manufacturing the same | Patent Publication Number 20060275943

US 20060275943 A1

Patent NumberUS 08314481 B2

Application Number11131727

Filled DateMay 18, 2005

Priority DateMay 18, 2005

Publication DateDec 7, 2006

Original AssigneeKingpak Technology Inc.

Current AssigneeKt Imaging Usa Llc

Inventor/ApplicantsKevin Chang
Chung Hsien Hsin
Chief Lin
Yves Huang

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