Routing under bond pad for the replacement of an interconnect layer | Patent Number 08319343

US 08319343 B2
Application Number11469960
Publication NumberUS 20070063352 A1
Pendency6 years, 2 months, 25 days
Filled DateSep 5, 2006
Priority DateSep 21, 2005
Publication DateMar 22, 2007
Expiration DateSep 20, 2025
Inventor/ApplicantsKurt G. Steiner
Taeho Kook
Mark A. Bachman
Vance D. Archer
Seung H. Kang
Sailesh M. Merchant
Vance D. Archer, III
Michael C. Ayukawa
Daniel P. Chesire
ExaminesNGUYEN, THINH T
Art Unit2897
Technology Center2800
Assignments
Bellnorthern Research
Current
Bell Semiconductor Llc
Current
Hilco Patent Acquisition 55 Llc
Current
Agere Systems BroadcomBroadcom
Original
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