Routing under bond pad for the replacement of an interconnect layer | Patent Publication Number 20070063352
US 20070063352 A1Patent NumberUS 08319343 B2
Application Number11469960
Filled DateSep 5, 2006
Priority DateSep 21, 2005
Publication DateMar 22, 2007
Original AssigneeBroadcom
Inventor/ApplicantsSeung H. Kang
Michael C. Ayukawa
Vance D. Archer
Taeho Kook
Sailesh M. Merchant
Daniel P. Chesire
Vance D. Archer, III
Mark A. Bachman
Kurt G. Steiner
Michael C. Ayukawa
Vance D. Archer
Taeho Kook
Sailesh M. Merchant
Daniel P. Chesire
Vance D. Archer, III
Mark A. Bachman
Kurt G. Steiner
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